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CLC is the leading supplier of copper (Cu) and titanium (Ti) etchants to the semiconductor packaging market in Taiwan, boasting the highest market share. Every year, over 20 million wafers are processed using CLC's Cu etchant, which is equivalent to processing one wafer every three seconds.

In addition to its high-quality copper etchants, CLC also supplies top-notch titanium (Ti) etchants that are widely used in both semiconductor packaging and advanced packaging processes.

Au etchant is a crucial component in the gold bump process of display driver ICs or optoelectronic applications, and it can also provide optional features of Al and Ni protection.

CLC is proud to offer a range of rework etchants that have been specifically designed for bump processes. Our rework etchants are highly effective in removing bumps without causing any damage to the Ti, Al, or passivation layers. With CLC's rework etchants, you can ensure the reliability and quality of your electronic devices.

CLC recognizes the importance of surface roughening or texturing for LED applications and offers a range of wet etching solutions that have been specifically designed to meet the needs of this industry. Our wet etching processes are highly effective in creating surface textures that enhance the light extraction efficiency of LEDs. With CLC's wet etching solutions, you can achieve superior LED performance and quality.

CLC is a leading supplier in Taiwan, known for being the first to mass-produce photoresist strippers with eco-friendly formulations. In 2017, we launched our first eco-friendly photoresist stripper product which has been in mass-production ever since.

The (111)nt-Cu Electroplating Solution adds special additives to the Cu electroplating solution to deposit a copper coating with a patented Cu micro-structure using the electrochemical electroplating process.

Cleaning is an essential process that is required at various stages of the semiconductor production process. CLC offers a wide range of cleaners specifically designed for different applications.

CLC offers both phosphoric acid and nitric acid series Ag etchants that are compatible with both wet bench and spin process tools.

CLC offers nitric acid series NiV etchants for use in wet bench and spin process machines, which can be utilized in both NiV/Cu etching processes.

CLC supplies potassium hydroxide (KOH) series anisotropic silicon (Si) etchants for use in MEMS and TSV reveal processes.

CLC supplies high-quality Titanium-Tungsten (TiW) etchants for gold bump process.