Photoresist Stripper

Photoresists are essential in the semiconductor process as they define the structural pattern of devices. After the electroplating or etching process, these photoresists need to be removed from the wafers. It is important that the photoresist stripper not only has effective stripping ability but also a low damage rate to the Cu and Al layers underneath.

Low-temperature cured Polyimide (PI) has recently been introduced for advanced packaging processes. However, compared to traditional high-temperature cured PI, they have lower chemical resistivity, making them more susceptible to damage if exposed to organic solvents. Additionally, residual stress in stacked PI layers can cause cracks during the multiple coating and curing processes. This presents a challenge for the stripper used in advanced packaging processes.

CLC’s photoresist strippers are highly effective in removing positive photoresists, negative photoresists, and dry film photoresists used in semiconductor packaging or optoelectronic processes. Our products are applicable to both spin and wet bench process machines. In addition to traditional DMSO or NMP series photoresist strippers, CLC began mass production of the first eco-friendly series stripper in Taiwan with PI protection in 2017. This product complies with the EU REACH regulation.