The BGBM (Backside Grinding, Backside Metallization) process utilizes a Ti/NiV/Ag stacking structure.
To facilitate this process, CLC offers both phosphoric acid and nitric acid series Ag etchants that are compatible with both wet bench and spin process tools.
Ag Etchant
Ag Etchant
Ag Etchant
CLC offers both phosphoric acid and nitric acid series Ag etchants that are compatible with both wet bench and spin process tools.
DETAIL