What is (111) nanotwinned copper (nt-Cu)
Highly (111) oriented nt-Cu was published by Prof. Chih Chen, National Chiao Tung University, Hsinchu, Taiwan, in 2012. This specific copper microstructure is achieved via electrodeposition method using proprietary plating additive designed and synthesized by CLC. The artificial microstructure possesses high density nanometer-spacing twins in columnar grain with unidirectional (111) orientation.
Material Properties of (111) nt-Cu
- High tensile strength
- High thermal stability
- High conductivity
- Excellent electromigration resistance
- Low Kirkendall void in Sn/Cu stacking
Applications of (111) nt-Cu in semiconductor packaging
- Fine line RDL in fan-out packaging
- Low temperature Cu to Cu direct bond in 3D IC
- High conductivity Cu interconnect