In the gold bump process of display driver ICs, sputtered Au is used as the UBM (Under Bump Metallization) layer, providing uniform current density throughout the entire wafer as the seed layer of the electroplating process of gold bump. Gold is also used as the electrode in LEDs.
CLC is proud to offer a variety of high-quality Au etchants for different applications, including iodine series and nitric acid series. For gold bump applications, CLC provides Au etchants with optional aluminum protection to prevent corrosion of the Al pad under the gold bump.
| Type | Iodine series | Nitric Acid series |
|---|---|---|
| Main Composition | KI/I2 | Nitric Acid |
| Application | Gold bump Optoelectronics |
Optoelectronics |
| Other Features | Al protection Ni protection |