| Type | Nitric Acid series | Phosphoric Acid series |
|---|---|---|
| Applicable Device |
RDL Copper Pillar Bump C4 Bump |
RDL Copper Pillar Bump |
| Other Features | No damage on Ti, Al and passivation layer | |
Rework Etchant
Rework Etchant
Rework Etchant
CLC is proud to offer a range of rework etchants that have been specifically designed for bump processes. Our rework etchants are highly effective in removing bumps without causing any damage to the Ti, Al, or passivation layers. With CLC's rework etchants, you can ensure the reliability and quality of your electronic devices.
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